The lead paste
Project
|
SPECS
|
Solder paste model
|
BD-613#
|
Alloy
|
Sn63Pb37
|
Color
|
Grey
|
Form
|
paste
|
Additive content(wt%)
|
9.5±1.0
|
Viscosity(25℃ Pa.S)
|
280±100
|
Particle volume(μm)
|
25-45
|
Water extraction(Ω.cm)
|
>5×104
|
Silver chromate test
|
Qualified
|
Silver chromate test
|
Qualified
|
Insulation resistance test surface(40℃/ 90%RH)
|
>1×1012
|
Expansion rate(%)
|
>90
|
The use of temperature
|
20-27℃
|
Printing service
|
12H
|
The use of temperature
|
<65%
|
Remove the solder paste
|
Isopropyl alcohol
|
Storage temperature
|
0-10℃Cold storage
|
Project details
|
63/37Solder paste that
|
NO.
|
BD-613
|
The alloy composition
|
Sn63/Pb37
|
Melting point(℃)
|
183℃
|
Solder paste appearance
|
The light gray, smooth like no stratification
|
Flux content(wt%)
|
10±0.5
|
Halogen contents(wt%)
|
RMA model
|
Viscosity(25℃时pa.s)
|
180±10
|
Particle volume(μm)
|
25-45
|
Water extraction resistance(Ω·cm)
|
>1×105
|
Ming acid silver paper test
|
Qualified
|
Copper corrosion test
|
Qualified
|
Surface insulation40℃/90RH
|
>1×1012
|
Expansion rate(%)
|
>89
|
Solder ball test
|
Qualified
|