In order to meet the mobile electronic appliances thin, small and high performance trends, miniaturized IC integrated circuit and high integration is more and more thorough. Replace the original QFP (Quad Flatpack Package), BGA (Ball Grid Array) and CSP (Chip Size Package) and other rapidly growing popularity.
The BGA and CSP are fixed on a circuit board through tiny solder ball, but easy because of the impact, bending and other external stress caused by bonding solder ball of damage, BGA and CSP from the base plate off or offset, such problems have attracted more and more attention.
At the bottom of this company developed Seal-glo underfill can penetrate between BGA, CSP and circuit board and heat curing, stress relaxation of the solder ball joint, reinforcement connection, improve product quality. In addition, due to heavy this product performance is excellent, the repeated use of expensive components and circuit board as possible.
Features
BD-118 series is the two mount bottom filling, has excellent heat resistance, moisture resistance and operation.
As one component epoxy resin, good fluidity, high efficiency.
The electrical properties, excellent moisture resistance and adhesive strength.
The rework performance.