The heat conduction medium of this product is mainly used for electronic components. Such as high power transistor (especially plastic pipe), diodes, integrated circuit and the substrate (aluminum, copper) heat conduction medium of contact gap.
Technical parameters of thermal grease BD-555L
Technical indicators |
BD-555L |
Dielectric constant(F/m) |
3.9 |
The volume resistance(Ω.cm) |
1.7×1015 |
Dielectric loss tangent |
2.3×10-3 |
Breakdown strength(MV/m) |
7.5 |
Density |
2.0±0.05 |
Cone penetration (25℃ before work) |
240±30 |
Oil level(%; 200℃×24hr) |
No |
Thermal conductivity(W/MK) |
1.35±0.05 |