The lead paste
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Project
|
SPECS
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|
Solder paste model
|
BD-613#
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|
Alloy
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Sn63Pb37
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|
Color
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Grey
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Form
|
paste
|
|
Additive content（wt%）
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9.5±1.0
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|
Viscosity(25℃ Pa.S)
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280±100
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|
Particle volume（μm）
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25-45
|
|
Water extraction（Ω.cm）
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＞5×104
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|
Silver chromate test
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Qualified
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|
Silver chromate test
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Qualified
|
|
Insulation resistance test surface（40℃/ 90%RH）
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＞1×1012
|
|
Expansion rate(%)
|
＞90
|
|
The use of temperature
|
20-27℃
|
|
Printing service
|
12H
|
|
The use of temperature
|
＜65%
|
|
Remove the solder paste
|
Isopropyl alcohol
|
|
Storage temperature
|
0-10℃Cold storage
|
|
Project details
|
63/37Solder paste that
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|
NO.
|
BD-613
|
|
The alloy composition
|
Sn63/Pb37
|
|
Melting point(℃)
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183℃
|
|
Solder paste appearance
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The light gray, smooth like no stratification
|
|
Flux content(wt%)
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10±0.5
|
|
Halogen contents(wt%)
|
RMA model
|
|
Viscosity(25℃时pa.s)
|
180±10
|
|
Particle volume(μm)
|
25-45
|
|
Water extraction resistance(Ω·cm)
|
>1×105
|
|
Ming acid silver paper test
|
Qualified
|
|
Copper corrosion test
|
Qualified
|
|
Surface insulation40℃/90RH
|
>1×1012
|
|
Expansion rate（%）
|
>89
|
|
Solder ball test
|
Qualified
|
