Powder: Sn96.5Ag3.0Cu0.5
Universal type lead-free solder paste point: 211 ℃
1, high strength, bright tin point, Wuxi pearl, no tombstone, good electrical properties.
2, can ensure the continuity printing, excellent anti collapse ability, surface insulation resistance. The residue after welding is low can be guaranteed by ICT test.
3, there is excellent in anti-interference ability, can still guarantee 12 hours continuous printing solder paste has good adhesion conditions.
4, process parameter range, can adapt to different environment, different equipment and different application process.
Item Details | SnAgCu Lead-free solder paste | 0.3Silver Lead-free solder paste |
Serial number | BD-965 | BD-965A |
Alloy composition | Sn96.5Ag3.0Cu0.5 | Sn99Ag0.3Cu0.7 |
Melting(℃) | 217℃ | 220℃ |
Appearance | Light gray,The sleek shape | Light gray,The sleek shape |
Flux content(wt%) | 11±0.5 | 11±0.5 |
Table halogen content(wt%) | RMA model | RMA model |
Viscosity(25℃时pa.s) | 180±10 | 190±10 |
Particle volume(μm) | 25-45 | 25-45 |
Water extraction resistance(Ω·cm) | >1×105 | >1×105 |
Ming acid silver paper test | Qualified | Qualified |
Copper corrosion test | Qualified | Qualified |
Surface insulation 40℃/90RH | >1×1013 | >1×1013 |
Expansion rate(%) | >90 | >85 |
Solder ball test | Qualified | Qualified |