Powder: Sn99.3Cu0.7
High temperature lead-free solder paste point: 227 ℃
1, low cost, tin lit, Wuxi pearl, no tombstone, organizational performance is good, the welding temperature high.
2, can ensure the continuity printing, excellent anti collapse ability, surface insulation resistance. The residue after welding is low can be guaranteed by ICT test.
3, there is excellent in anti-interference ability, can still guarantee 12 hours continuous printing solder paste has good adhesion conditions.
Item Details | High temperature solder Description |
Serial number | BD-966 |
Alloy composition | Sn99.3/Cu0.7 |
Melting(℃) | 227 |
Paste Appearance | Light gray,The sleek shape no stratification |
Flux content(wt%) | 11±0.5 |
Table halogen content(wt%) | RMA model |
Viscosity(25℃时pa.s) | 180±10 |
Particle volume(μm) | 25-45 |
Water extraction resistance(Ω·cm) | >1×105 |
Ming acid silver paper test | Qualified |
Copper corrosion test | Qualified |
Surface insulation40℃/90RH | >1×1012 |
Expansion rate(%) | >80 |
Solder ball test | Qualified |