Powder: Sn64.0Bi35.0Ag1.0
Low temperature type solder paste containing silver, melting point: 178 ℃
1, bright tin point, Wuxi pearl, no tombstone, good electrical properties.
2, can ensure the continuity printing, excellent anti collapse ability, surface insulation resistance. The residue after welding is low can be guaranteed by ICT test.
3, there is excellent in anti-interference ability, can still guarantee 12 hours continuous printing solder paste has good adhesion conditions.
Item Details | Tin-bismuth Description | Tin-bismuth silver Description |
Serial number | 580 | 580A |
Alloy composition | Sn42Bi58 | Sn64Bi35Ag1 |
Melting(℃) | 138℃ | 178℃ |
Appearance | Light gray,The sleek shape | Light gray,The sleek shape |
Flux content(wt%) | 9.0±1.0 | 9.0±1.0 |
Table halogen content(wt%) | <0.01 | <0.01 |
Viscosity(25℃时pa.s) | 180±10% | 190±10% |
Particle volume(μm) | 25-45 | 25-45 |
Water extraction resistance(Ω·cm) | >1×105 | >1×105 |
Ming acid silver paper test | Qualified | Qualified |
Copper corrosion test | Qualified | Qualified |
Surface insulation 40℃/90RH | >5×1011 | >5×1011 |
Expansion rate(%) | >75 | >80 |
Solder ball test | Qualified | Qualified |