Product features:
1: is a single component epoxy potting material, thermal curing.
2: with low expansion coefficient, non flammable, storage stability and other characteristics.
3: after curing, no bubbles, smooth surface, good gloss, high hardness.
Acid and alkali resistance of.
4: after curing, strong water resistance and moisture resistance. 100 degrees of water for 72 hour, moisture 0.2%; 100 degrees of water for 1000 hour, moisture 2.5%.
5: after curing with good insulation, strength and other electrical characteristics.
6: the cured colloid of high temperature resistant. In 200 ° at 1 hours without changing strength, strength at 160 ° 10 hours free environment change.
Scope of application:
1: where the need for perfusion, packaging protection, moisture-proof insulating electronic or other products can be used.
2: especially in the higher demands on the electrical properties of temperature, humidity, relay, sensor, a trigger, IC chip products such as encapsulation and filling.
Technical parameters:
Project | SPECS | SPECS |
Model | BD-607 | BD-607Y |
Environmental classification | RoHS model | RoHS model |
Appearance | Black viscous liquid | Black viscous liquid |
Density | 1.19±0.05 | 1.20±0.02 |
Viscosity(25℃ mPa.S) | 4.0~6.1×104 | 4.0~7.1×104 |
Withstanding Voltage(KV/mm) | 22-29 | 22-30 |
Volume resistivity(25℃ Ω.mm3) | 5.3×1017 | 5.3×1017 |
Surface resistivity(25℃ Ω) | 3.6×1017 | 3.6×1017 |
Impact strength(Kg/ mm2) | 9-12 | 9-13 |
Curing conditions | 2H/90℃ after 2H/130℃ | 2H/90℃ after 2H/130℃ |
Store | 180day/0-10℃ | 180day/0-10℃ |